Physical Design

At NokshaSemi, we bridge the gap between design ideas and real-world chips, ensuring efficient and reliable functionality through our comprehensive physical design services. We specialize in advanced process nodes, including 12nm, 6nm, 4nm, and below, delivering world-leading chip desAt NokshaSemi, we bridge the gap between design ideas and real-world chips, ensuring efficient and reliable functionality through our comprehensive physical design services. We specialize in advanced process nodes, including 12nm, 6nm, 4nm, and below, delivering world-leading chip designs from RTL to GDS.igns from RTL to GDS.

Physical Design

Our Capabilities Include

  • RTL to GDSII Mastery: Complete design flow expertise from RTL synthesis to GDSII output.
  • Advanced Process Focus: Specialization in 12 nm, 6nm, 4nm and below semiconductor solutions.
  • Efficient Synthesis and APR: Streamlined techniques for optimal chip layout and performance.
  • Custom Design Flows: Tailored flows to meet project requirements.
  • Block-Level Precision: Management of blocks with millions of instances, including synthesis, APR, and sign-off.
  • Block Coordination: Oversight of multiple blocks, resolving critical issues.
  • Top-Level Integration: Handling complex chips with millions of instances and macros, including floor planning and tape-out.
  • Timing Closure and ECO Management: Ensuring timing closure and managing ECOs.
  • Low Power, High-Speed Design: Implementing low-power strategies while maintaining performance.
  • SDC Analysis and Power Intent: Analyzing constraints and implementing power intent files.
  • Crosstalk and Noise Mitigation: Addressing crosstalk and noise for reliable functionality.
  • Physical Verification: DRC, LVS, and antenna checks.
  • Logic Equivalence Check: Ensuring consistency between design stages.

NokshaSemi's engineering team is constantly pushing boundaries. Over half of our engineers are pioneering designs in the cutting-edge sub-20nm technology node.  This translates to our team achieving multiple tape outs annually, ensuring each member possesses in-depth knowledge of the latest EDA tools within their domain.